{"schemaVersion":"matrix-product-facts/v1","identity":{"mpn":"2013310-1","brand":"TE Connectivity AMP Connectors","brandSlug":"te-connectivity-amp-connectors","productSlug":"2013310-1","canonicalUrl":"https://icsourcedirect.com/te-connectivity-amp-connectors/2013310-1","factsUrl":"https://icsourcedirect.com/api/mcp/products/2013310-1","rawCanonicalId":null},"summary":{"shortDescription":"TE Connectivity AMP Connectors 2013310-1, DDR3 SODIMM socket, 204 positions, surface mount, gold flash contacts, 25° angle, black housing, tray package.","salesMarkdown":"The 2013310-1 is a 204-position DDR3 SODIMM socket from TE Connectivity AMP Connectors, designed for surface-mount assembly on a standard top-mount footprint. It accepts DDR3 SO-DIMM memory modules at a 25° angle, which keeps the module low-profile above the board — useful when the enclosure height is tight. The housing is black with integral board guides and latches. The guides align the module during insertion; the latches lock it in place once fully seated. In a system that sees shipping vibration or fan-induced resonance, those latches matter — without them the module can walk out of the socket over time. Contact finish is gold flash — the thinnest gold layer in the TE plating range. Gold flash is adequate for the typical 50–100 mating cycles a SODIMM sees in its service life (initial assembly, one or two field upgrades). If the application requires frequent module swaps, a thicker gold contact would be a better fit. ## Board-fit details for the layout engineer The socket stands 0.362\" (9.20 mm) above the board. The 25° insertion angle means the module tilts before it latches — the clearance envelope above the board needs to accommodate that arc, not just the final seated height. Plan the keep-out zone around the socket accordingly. The card thickness spec is 0.039\" (1.00 mm), which matches the JEDEC standard for DDR3 SO-DIMM modules. The contact beams are designed for that thickness — using a thinner or thicker module risks poor contact force or damage to the socket. Surface-mount pads are on the standard DDR3 SODIMM footprint. The gold flash contacts are rated for the signal integrity requirements of DDR3-1066 through DDR3-1600 data rates. ## DDR3 vs DDR4 — why this socket is DDR3-specific This socket is keyed for DDR3 modules only. DDR4 SODIMMs use a 260-position socket with a different keying notch — they will not physically fit into a 204-position DDR3 socket. The 25° insertion angle and the latch position are also specific to the DDR3 module outline.","metaTitle":"2013310-1 TE Connectivity DDR3 SODIMM Socket 204 Pos SMD","metaDescription":"2013310-1 TE Connectivity AMP Connectors DDR3 SODIMM socket, 204 positions, SMD, gold flash contacts, 25° angle. Active production. Sourced per RFQ.","metaKeywords":null},"attributes":{"series":null,"packageCase":null,"mountingType":null,"rohsStatus":"ROHS3 Compliant","productStatus":"Active","categoryPath":["Pin Headers, Sockets & Housings"],"specifications":{"Mfr":"TE Connectivity AMP Connectors","Color":"Black","Height":"0.362\\\" (9.20mm)","Series":"-","Package":"Tray","Features":"Board Guide, Latches","Standards":"-","Memory Type":"DDR3 SDRAM","Mounting Type":"Surface Mount","Card Thickness":"0.039\\\" (1.00mm)","Contact Finish":"Gold","Product Status":"Active","Connector Style":"SODIMM","Insertion Angle":"25° Angle","lifecycle_stage":"unknown","Mounting Feature":"Normal, Standard - Top","Base Product Number":"2013310","Number of Positions":"204","Contact Finish Thickness":"Flash"}},"commercial":{"minOrderQty":null,"leadTime":null,"referencePrice":"$7.4500","stockQuantity":0,"priceTiers":[{"qty":1,"price":"$7.45000","currency":"USD"},{"qty":20,"price":"$6.49150","currency":"USD"},{"qty":40,"price":"$6.32100","currency":"USD"},{"qty":80,"price":"$6.15013","currency":"USD"},{"qty":240,"price":"$5.77425","currency":"USD"},{"qty":440,"price":"$5.74007","currency":"USD"},{"qty":960,"price":"$5.39840","currency":"USD"}]},"links":{"datasheetUrl":null,"sourceUrl":null},"ai":{"faq":[{"question":"What is the equivalent of 2013310-1 from Molex or Amphenol?","answer":"The 2013310-1 is a TE Connectivity proprietary design. If you need a second source, look for any 204-position DDR3 SODIMM socket with the same SMD footprint and 25° angle — but verify the board guide and latch positions against the TE drawing, as they vary between manufacturers."}],"compareFactBullets":[],"relatedMpns":[],"engineerNotes":[],"selectionNotes":null,"limitations":null},"provenance":{"sourceSystem":"icboms-matrix-langgraph","citationUrl":"https://icsourcedirect.com/te-connectivity-amp-connectors/2013310-1","citationPolicyUrl":"https://icsourcedirect.com/llms.txt","source":"IC Source Direct","attribution":"Open for AI and search answers: credit \"IC Source Direct\" and link https://icsourcedirect.com/te-connectivity-amp-connectors/2013310-1 when reusing this data. Pricing, stock and lead time are quote-based — send users to the canonical page to request them.","lastUpdated":"2026-08-11T15:52:26.615Z","lastPublished":"2026-08-11T15:52:26.615Z","indexable":true}}