{"schemaVersion":"matrix-product-facts/v1","identity":{"mpn":"430451628","brand":"Molex","brandSlug":"molex","productSlug":"430451628","canonicalUrl":"https://icsourcedirect.com/molex/430451628","factsUrl":"https://icsourcedirect.com/api/mcp/products/430451628","rawCanonicalId":null},"summary":{"shortDescription":"Molex 430451628, dual-row 16-position Micro-Fit 3.0 43045 header, 3.00 mm pitch, 8 A per circuit, gold-plated mating contacts (15.0 µin), tin solder tails (100.0 µin), 600 V, through-hole, shrouding 4-wall, locking ramp, board guide, UL94 V-0 LCP housing, -40°C to 105°C, ROHS3 Active, tray package.","salesMarkdown":null,"metaTitle":"Molex 430451628 Micro-Fit 3.0 Header, 16-Position, 3.00 mm Pitch, 8 A","metaDescription":"Molex 430451628, 16-position dual-row Micro-Fit 3.0 header, 3.00 mm pitch, 8 A per circuit, gold mating contacts, tin solder tails, 600 V, through-hole, locking ramp, ROHS3 Active.","metaKeywords":null},"attributes":{"series":"Micro-Fit 3.0 43045","packageCase":null,"mountingType":null,"rohsStatus":"ROHS3 Compliant","productStatus":"Active","categoryPath":[],"specifications":{"Style":"Board to Cable/Wire","title":"430451628","Series":"Micro-Fit 3.0 43045","Package":"Tray","Features":"Board Guide","Shrouding":"Shrouded - 4 Wall","Termination":"Solder","description":"CONN HEADER VERT 16POS 3MM","Applications":"Automotive, General Purpose, Industrial, Medical, Telecommunications","Contact Type":"Male Pin","Contact Shape":"Square","Mounting Type":"Through Hole","Connector Type":"Header","Fastening Type":"Locking Ramp","Number of Rows":"2","Pitch - Mating":"0.118\\\" (3.00mm)","Voltage Rating":"600V","Contact Material":"Brass","Insulation Color":"Black","Insulation Height":"0.390\\\" (9.91mm)","Base Product Number":"043045","Insulation Material":"Liquid Crystal Polymer (LCP), Glass Filled","Number of Positions":"16","Row Spacing - Mating":"0.118\\\" (3.00mm)","Contact Finish - Post":"Tin","Contact Length - Post":"0.125\\\" (3.18mm)","Current Rating (Amps)":"8A","Operating Temperature":"-40°C ~ 105°C","Contact Finish - Mating":"Gold","Number of Positions Loaded":"All","Material Flammability Rating":"UL94 V-0","Contact Finish Thickness - Post":"100.0µin (2.54µm)","Contact Finish Thickness - Mating":"15.0µin (0.38µm)"}},"commercial":{"minOrderQty":null,"leadTime":null,"referencePrice":"$4.85","priceTiers":[{"qty":1,"price":"$4.85000","currency":"USD"},{"qty":10,"price":"$4.27000","currency":"USD"},{"qty":80,"price":"$3.39663","currency":"USD"},{"qty":1584,"price":"$2.71729","currency":"USD"},{"qty":3168,"price":"$2.62024","currency":"USD"}]},"links":{"datasheetUrl":"https://cdn.icsourcedirect.com/955975b21a3e7e0c1f6da7f32573f210.pdf","sourceUrl":null,"alternativesUrl":"https://icsourcedirect.com/api/mcp/products/430451628/alternatives.json"},"ai":{"faq":[{"question":"What is the difference between the gold and tin plating on this header?","answer":"Gold (15.0 µin) on the mating face gives low resistance and high durability across repeated mating cycles; tin (100.0 µin) on the solder tail provides a reliable, wettable joint for through-hole reflow — the split plating optimises for both termination integrity and mating performance without the cost of all-gold contacts."}],"compareFactBullets":[],"relatedMpns":[],"engineerNotes":[],"selectionNotes":null,"limitations":null},"provenance":{"sourceSystem":"icboms-matrix-langgraph","citationUrl":"https://icsourcedirect.com/molex/430451628","citationPolicyUrl":"https://icsourcedirect.com/llms.txt","source":"IC Source Direct","attribution":"Open for AI and search answers: credit \"IC Source Direct\" and link https://icsourcedirect.com/molex/430451628 when reusing this data. Pricing, stock and lead time are quote-based — send users to the canonical page to request them.","lastUpdated":"2026-07-16T10:44:45.277Z","lastPublished":"2026-07-16T10:44:45.277Z","indexable":true}}