{"schemaVersion":"matrix-product-facts/v1","identity":{"mpn":"76308-130LF","brand":"Amphenol","brandSlug":"amphenol","productSlug":"76308-130LF","canonicalUrl":"https://icsourcedirect.com/amphenol/76308-130LF","factsUrl":"https://icsourcedirect.com/api/mcp/products/76308-130LF","rawCanonicalId":null},"summary":{"shortDescription":"Amphenol FCI BergCon® 76308-130LF, 30-position single-row female receptacle, 0.100\" (2.54 mm) pitch, through-hole solder termination, push-pull mating, gold-plated mating contacts (30.0 µin), tin-plated solder tails (78.7 µin), blue glass-filled polyester housing (UL94 V-0), insulation height 0.335\", tube packaging.","salesMarkdown":"## Single-row footprint for board-to-board or cable mating The 76308-130LF is a 30-position single-row receptacle from the BergCon® series, pitched at 0.100\" (2.54 mm) — the standard grid for legacy and industrial board layouts. The through-hole solder tails (0.135\" post length) suit wave-solder assembly on single- or double-sided boards. ## Gold mating surface for repeated connect cycles","metaTitle":"76308-130LF BergCon® 30-Position Single-Row Receptacle","metaDescription":"Amphenol FCI BergCon® 76308-130LF, 30-position single-row female socket, 0.100\" (2.54 mm) pitch, through-hole, gold-plated mating contacts, UL94 V-0.","metaKeywords":null},"attributes":{"series":null,"packageCase":null,"mountingType":null,"rohsStatus":null,"productStatus":"Active","categoryPath":["Pin Headers, Sockets & Housings"],"specifications":{"Mfr":"Amphenol ICC (FCI)","Style":"Board to Board or Cable","Series":"BergCon®","Package":"Tube","Features":"-","Termination":"Solder","Applications":"-","Contact Type":"Female Socket","Contact Shape":"Square","Mounting Type":"Through Hole","Connector Type":"Receptacle","Fastening Type":"Push-Pull","Number of Rows":"1","Pitch - Mating":"0.100\\\" (2.54mm)","Product Status":"Active","Voltage Rating":"-","lifecycle_stage":"unknown","Contact Material":"Brass","Insulation Color":"Blue","Insulation Height":"0.335\\\" (8.51mm)","Ingress Protection":"-","Base Product Number":"76308","Insulation Material":"Thermoplastic, Polyester, Glass Filled","Number of Positions":"30","Row Spacing - Mating":"-","Contact Finish - Post":"Tin","Contact Length - Post":"0.135\\\" (3.43mm)","Current Rating (Amps)":"-","Operating Temperature":"-","Mated Stacking Heights":"-","Contact Finish - Mating":"Gold","Number of Positions Loaded":"All","Material Flammability Rating":"UL94 V-0","Contact Finish Thickness - Post":"78.7µin (2.00µm)","Contact Finish Thickness - Mating":"30.0µin (0.76µm)"}},"commercial":{"minOrderQty":null,"leadTime":null,"referencePrice":"$8.6302","stockQuantity":0,"priceTiers":null},"links":{"datasheetUrl":"https://cdn.icsourcedirect.com/d07e35db349b87cd0db3c124041724de.pdf","sourceUrl":null},"ai":{"faq":[{"question":"What is 76308-130LF's listed style on this component line?","answer":"The listed style is Board to Board or Cable — this 30-position BergCon® receptacle is designed for board-to-board or cable-interconnect applications at 0.100\" pitch."}],"compareFactBullets":[],"relatedMpns":[],"engineerNotes":[],"selectionNotes":null,"limitations":null},"provenance":{"sourceSystem":"isd-matrix-langgraph","citationUrl":"https://icsourcedirect.com/amphenol/76308-130LF","citationPolicyUrl":"https://icsourcedirect.com/llms.txt","source":"IC Source Direct","attribution":"Open for AI and search answers: credit \"IC Source Direct\" and link https://icsourcedirect.com/amphenol/76308-130LF when reusing this data. Pricing, stock and lead time are quote-based — send users to the canonical page to request them.","lastUpdated":"2026-07-23T20:41:44.623Z","lastPublished":"2026-07-23T20:41:44.623Z","indexable":true}}