{"schemaVersion":"matrix-product-facts/v1","identity":{"mpn":"840-AG11D-ESL-LF","brand":"TE Connectivity AMP Connectors","brandSlug":"te-connectivity-amp-connectors","productSlug":"840-AG11D-ESL-LF","canonicalUrl":"https://icsourcedirect.com/te-connectivity-amp-connectors/840-AG11D-ESL-LF","factsUrl":"https://icsourcedirect.com/api/mcp/products/840-AG11D-ESL-LF","rawCanonicalId":null},"summary":{"shortDescription":"TE Connectivity AMP Connectors Series 800, 840-AG11D-ESL-LF, 40 (2 x 20) position DIP header, 0.100\" (2.54 mm) pitch, 0.6\" (15.24 mm) row spacing, through-hole solder termination, gold flash mating and post contacts, open-frame PCT housing, UL94 V-0.","salesMarkdown":"## 40-Pin DIP Header for High-Density Board Interconnects The 840-AG11D-ESL-LF: The open-frame PCT housing (UL94 V-0 rated) exposes the solder tails for visual inspection and rework, while the beryllium copper mating contacts with gold flash finish provide reliable signal-level connections for repeated but not high-cycle mating. Copper post material with gold flash finish keeps the solder joint corrosion-resistant and compatible with standard lead-free soldering profiles. ## Gold Flash Contacts and Contact Resistance Contact resistance is rated at 10 mOhm, a typical value for a gold-on-gold interface in a dry-circuit signal path — the beryllium copper beam maintains normal force to keep resistance stable over temperature.","metaTitle":"840-AG11D-ESL-LF TE Connectivity 40-Pin DIP Header","metaDescription":"840-AG11D-ESL-LF TE Connectivity AMP Connectors — 40-position DIP header, 0.100\" pitch, 0.6\" row spacing, gold flash contacts, through-hole solder termination.","metaKeywords":null},"attributes":{"series":null,"packageCase":null,"mountingType":null,"rohsStatus":null,"productStatus":"Active","categoryPath":["Pin Headers, Sockets & Housings"],"specifications":{"Mfr":"TE Connectivity AMP Connectors","Type":"DIP, 0.6\\\" (15.24mm) Row Spacing","Series":"800","Package":"Tube","Features":"Open Frame","Termination":"Solder","Pitch - Post":"0.100\\\" (2.54mm)","Mounting Type":"Through Hole","Pitch - Mating":"0.100\\\" (2.54mm)","Product Status":"Active","lifecycle_stage":"unknown","Housing Material":"Polycyclohexylenedimethylene Terephthalate (PCT), Polyester","Contact Resistance":"10mOhm","Base Product Number":"840","Contact Finish - Post":"Gold","Operating Temperature":"-55°C~105°C","Contact Finish - Mating":"Gold","Contact Material - Post":"Copper","Termination Post Length":"0.125\\\" (3.18mm)","Contact Material - Mating":"Beryllium Copper","Material Flammability Rating":"UL94 V-0","Contact Finish Thickness - Post":"Flash","Contact Finish Thickness - Mating":"Flash","Number of Positions or Pins (Grid)":"40 (2 x 20)"}},"commercial":{"minOrderQty":null,"leadTime":null,"referencePrice":"$5.4800","priceTiers":null},"links":{"datasheetUrl":"https://cdn.icsourcedirect.com/0e23519e227e60bd40ff0d70be4b8440.pdf","sourceUrl":null,"alternativesUrl":"https://icsourcedirect.com/api/mcp/products/840-AG11D-ESL-LF/alternatives.json"},"ai":{"faq":[{"question":"What is the row spacing of 840-AG11D-ESL-LF?","answer":"The row spacing is 0.6\" (15.24 mm), which is the standard DIP dimension for a 40-pin dual-in-line package."}],"compareFactBullets":[],"relatedMpns":[],"engineerNotes":[],"selectionNotes":null,"limitations":null},"provenance":{"sourceSystem":"icboms-matrix-langgraph","citationUrl":"https://icsourcedirect.com/te-connectivity-amp-connectors/840-AG11D-ESL-LF","citationPolicyUrl":"https://icsourcedirect.com/llms.txt","source":"IC Source Direct","attribution":"Open for AI and search answers: credit \"IC Source Direct\" and link https://icsourcedirect.com/te-connectivity-amp-connectors/840-AG11D-ESL-LF when reusing this data. Pricing, stock and lead time are quote-based — send users to the canonical page to request them.","lastUpdated":"2026-08-11T15:52:26.615Z","lastPublished":"2026-08-11T15:52:26.615Z","indexable":true}}