{"schemaVersion":"matrix-product-facts/v1","identity":{"mpn":"86832-424HLF","brand":"Amphenol","brandSlug":"amphenol","productSlug":"86832-424HLF","canonicalUrl":"https://icsourcedirect.com/amphenol/86832-424HLF","factsUrl":"https://icsourcedirect.com/api/mcp/products/86832-424HLF","rawCanonicalId":null},"summary":{"shortDescription":"Amphenol FCI BERGSTIK® II, 0.100\" (2.54mm) pitch, 24-position dual-row unshrouded header, 5A per circuit, 110V, tin-plated phosphor bronze contacts, through-hole solder, UL94 V-0 black insulator.","salesMarkdown":"The Amphenol FCI 86832-424HLF is a 24-position dual-row unshrouded header from the BERGSTIK® II series, on the classic 0.100\" (2.54 mm) pitch that matches standard DIP footprints and 0.1\" grid prototyping boards. All 24 positions are loaded with square male pins, tin-plated on both the mating surface and the solder tails, with a mating contact thickness of 100.0 µ\" (2.54 µm). The 0.100\" (2.54 mm) pitch and 0.100\" (2.54 mm) row spacing mean this header drops onto a standard 0.1\" grid — no footprint surprises if your board layout uses legacy DIP or BergStik-compatible patterns. With 100 µ\" of tin on the mating side, you get a solid initial connection, but tin-on-tin interfaces are prone to fretting corrosion under vibration or repeated thermal cycling. This header is best suited for low-mating-cycle applications — think one-time assembly or infrequent rework — rather than a field-serviceable interconnect. No official cross-reference or direct equivalent is on record — the BERGSTIK® II series includes many 24-position dual-row headers, but pin length and plating options vary, so confirm the 0.525\" (13.34 mm) overall contact length and 0.100\" (2.54 mm) post length match your board stack-up before committing.","metaTitle":"Amphenol BERGSTIK II 86832-424HLF Header, 24 Pos 2.54mm","metaDescription":"Amphenol BERGSTIK II 86832-424HLF unshrouded header, 24 positions, 0.100\" pitch, 5A, 110V, tin-plated contacts. Active production, sourced to order.","metaKeywords":null},"attributes":{"series":null,"packageCase":null,"mountingType":null,"rohsStatus":null,"productStatus":"Active","categoryPath":["Pin Headers, Sockets & Housings"],"specifications":{"Style":"Board to Board","title":"86832-424HLF","Series":"BERGSTIK® II","Package":"Bag","Shrouding":"Unshrouded","Termination":"Solder","Contact Type":"Male Pin","Contact Shape":"Square","Mounting Type":"Through Hole","Connector Type":"Header","Fastening Type":"Push-Pull","Number of Rows":"2","Pitch - Mating":"0.100\\\" (2.54mm)","Voltage Rating":"110V","Contact Material":"Phosphor Bronze","Insulation Color":"Black","Insulation Height":"0.100\\\" (2.54mm)","Base Product Number":"86832","Number of Positions":"24","Row Spacing - Mating":"0.100\\\" (2.54mm)","Contact Finish - Post":"Tin","Contact Length - Post":"0.100\\\" (2.54mm)","Current Rating (Amps)":"5A","Overall Contact Length":"0.525\\\" (13.34mm)","Contact Finish - Mating":"Tin","Contact Length - Mating":"0.325\\\" (8.26mm)","Number of Positions Loaded":"All","Material Flammability Rating":"UL94 V-0","Contact Finish Thickness - Mating":"100.0µin (2.54µm)"}},"commercial":{"minOrderQty":null,"leadTime":null,"referencePrice":"$3.2600","priceTiers":null},"links":{"datasheetUrl":"https://cdn.icsourcedirect.com/c8f0394c32e820c9621af8eb0b9440c3.pdf","sourceUrl":null,"alternativesUrl":"https://icsourcedirect.com/api/mcp/products/86832-424HLF/alternatives.json"},"ai":{"faq":[{"question":"What is the current rating of 86832-424HLF?","answer":"The 86832-424HLF is rated 5 A per circuit at 110 V, with tin-plated phosphor bronze contacts. The 5 A figure applies per contact under typical conditions; derate above ambient temperature per the manufacturer's curve."},{"question":"Does 86832-424HLF have a locking mechanism?","answer":"No. The 86832-424HLF is an unshrouded header with a push-pull fastening type — there is no latch, lock, or retention ramp. The mating receptacle relies on friction from the pin-to-socket interface to stay mated."},{"question":"What is the pitch of 86832-424HLF?","answer":"The pitch is 0.100\" (2.54 mm) on both the row-to-row and position-to-position spacing, matching the standard 0.1\" grid used by legacy DIP packages and BergStik-compatible footprints."}],"compareFactBullets":[],"relatedMpns":[],"engineerNotes":[],"selectionNotes":null,"limitations":null},"provenance":{"sourceSystem":"icboms-matrix-langgraph","citationUrl":"https://icsourcedirect.com/amphenol/86832-424HLF","citationPolicyUrl":"https://icsourcedirect.com/llms.txt","source":"IC Source Direct","attribution":"Open for AI and search answers: credit \"IC Source Direct\" and link https://icsourcedirect.com/amphenol/86832-424HLF when reusing this data. Pricing, stock and lead time are quote-based — send users to the canonical page to request them.","lastUpdated":"2026-08-11T15:52:26.615Z","lastPublished":"2026-08-11T15:52:26.615Z","indexable":true}}