{"schemaVersion":"matrix-product-facts/v1","identity":{"mpn":"87052-118HLF","brand":"Amphenol","brandSlug":"amphenol","productSlug":"87052-118HLF","canonicalUrl":"https://icsourcedirect.com/amphenol/87052-118HLF","factsUrl":"https://icsourcedirect.com/api/mcp/products/87052-118HLF","rawCanonicalId":null},"summary":{"shortDescription":"Amphenol FCI BERGSTIK® II, 18 Position, 0.100\" (2.54mm) Pitch, Dual Row, Through Hole, Unshrouded Header, Male Pin, Gold Plating, 5A, 110V, UL94 V-0.","salesMarkdown":"## BERGSTIK II Unshrouded Header — 18-Position, 0.100\" Pitch It uses a 0.100\" (2.54 mm) square-pin grid on both the mating pitch and row spacing — a standard footprint that matches legacy and current board layouts. Rated 5 A per circuit at 110 V, the 87052-118HLF is sized for signal-level and moderate power interconnects — think I/O, control, or low-current board-to-board links. The 5 A per-contact rating is typical for a 0.100\" pitch header with phosphor bronze contacts; the limiting factor is the pin density and the PCB trace width, not the contact itself. The 30.0 µin (0.76 µm) gold plating on the mating surface gives good corrosion resistance and supports repeated mating cycles in non-sealed environments — a reasonable choice for field-serviceable assemblies. The 0.990\" (25.15 mm) overall contact length and 0.120\" (3.05 mm) post length mean it suits standard 1.6 mm PCBs; the post protrudes enough for a clean solder fillet on the back side without bottoming out against the board. ## What It Mates With","metaTitle":"Amphenol FCI 87052-118HLF BERGSTIK II Header, 18 Pos","metaDescription":"Amphenol FCI BERGSTIK II through-hole header, 18 positions, 0.100\" (2.54 mm) pitch, dual-row, unshrouded, gold-plated contacts, 5 A, 110 V, UL94 V-0.","metaKeywords":null},"attributes":{"series":null,"packageCase":null,"mountingType":null,"rohsStatus":null,"productStatus":"Active","categoryPath":["Pin Headers, Sockets & Housings"],"specifications":{"Mfr":"Amphenol ICC (FCI)","Style":"Board to Board","Series":"BERGSTIK® II","Package":"Bag","Features":"-","Shrouding":"Unshrouded","Termination":"Solder","Applications":"-","Contact Type":"Male Pin","Contact Shape":"Square","Mounting Type":"Through Hole","Connector Type":"Header","Fastening Type":"Push-Pull","Number of Rows":"2","Pitch - Mating":"0.100\\\" (2.54mm)","Product Status":"Active","Voltage Rating":"110V","lifecycle_stage":"unknown","Contact Material":"Phosphor Bronze","Insulation Color":"Black","Insulation Height":"0.100\\\" (2.54mm)","Ingress Protection":"-","Base Product Number":"87052","Insulation Material":"-","Number of Positions":"18","Row Spacing - Mating":"0.100\\\" (2.54mm)","Contact Finish - Post":"-","Contact Length - Post":"0.120\\\" (3.05mm)","Current Rating (Amps)":"5A","Operating Temperature":"-","Mated Stacking Heights":"-","Overall Contact Length":"0.990\\\" (25.15mm)","Contact Finish - Mating":"Gold or Gold, GXT™","Contact Length - Mating":"0.770\\\" (19.56mm)","Number of Positions Loaded":"All","Material Flammability Rating":"UL94 V-0","Contact Finish Thickness - Post":"-","Contact Finish Thickness - Mating":"30.0µin (0.76µm)"}},"commercial":{"minOrderQty":null,"leadTime":null,"referencePrice":"$2.5700","priceTiers":null},"links":{"datasheetUrl":"https://cdn.icsourcedirect.com/c8f0394c32e820c9621af8eb0b9440c3.pdf","sourceUrl":null,"alternativesUrl":"https://icsourcedirect.com/api/mcp/products/87052-118HLF/alternatives.json"},"ai":{"faq":[{"question":"What is the difference between 87052-118HLF and 87052-118RLF?","answer":"The primary difference is the contact plating: the HLF suffix indicates gold or gold GXT™ plating (30.0 µin / 0.76 µm on the mating surface), while the RLF suffix designates a tin-plated version. Both share the same 18-position, 0.100\" pitch, dual-row, through-hole form factor. Choose the HLF for applications requiring repeated mating cycles or better corrosion resistance; the RLF is a lower-cost option for one-time or enclosed connections."},{"question":"Can the 87052-118HLF be used for wire-to-board connections?","answer":"No, this is a board-to-board header. It is a male pin header designed to mate with a female socket receptacle on another PCB or an IDC cable assembly. For wire-to-board connections, you would need a crimp housing and terminal system (e.g., a BERGSTIK compatible crimp-to-wire receptacle)."}],"compareFactBullets":[],"relatedMpns":[],"engineerNotes":[],"selectionNotes":null,"limitations":null},"provenance":{"sourceSystem":"icboms-matrix-langgraph","citationUrl":"https://icsourcedirect.com/amphenol/87052-118HLF","citationPolicyUrl":"https://icsourcedirect.com/llms.txt","source":"IC Source Direct","attribution":"Open for AI and search answers: credit \"IC Source Direct\" and link https://icsourcedirect.com/amphenol/87052-118HLF when reusing this data. Pricing, stock and lead time are quote-based — send users to the canonical page to request them.","lastUpdated":"2026-08-11T15:52:26.615Z","lastPublished":"2026-08-11T15:52:26.615Z","indexable":true}}