{"schemaVersion":"matrix-product-facts/v1","identity":{"mpn":"87901-158HLF","brand":"Amphenol","brandSlug":"amphenol","productSlug":"87901-158HLF","canonicalUrl":"https://icsourcedirect.com/amphenol/87901-158HLF","factsUrl":"https://icsourcedirect.com/api/mcp/products/87901-158HLF","rawCanonicalId":null},"summary":{"shortDescription":"Amphenol FCI BergStik II 87901-158HLF, 58-position, dual-row, 0.100\" (2.54 mm) pitch, unshrouded male header, through-hole solder termination, 5 A, 110 V, 30 µ\" gold plating, UL94 V-0.","salesMarkdown":"It sits on the standard 0.100\" (2.54 mm) pitch grid — the same spacing as legacy DIP packages and breadboard prototyping boards — so it drops into a familiar footprint. The two rows are spaced 0.100\" (2.54 mm) apart as well, giving a compact 58-pin array that fits a 29-per-row layout. Rated 5 A per circuit at 110 V, this is a signal-level interconnect; the 30 µ\" gold plating on the mating surface handles repeated connect-disconnect cycles without the fretting corrosion you'd see with tin on a header that gets field-service unplugging. Through-hole termination with 0.120\" (3.05 mm) post length — the solder tail clears a standard 1.6 mm PCB and leaves enough stub for a reliable fillet. The overall contact length is 1.040\" (26.42 mm), with 0.820\" (20.83 mm) of that available for mating. That long mating pin is designed to reach into a standard IDC socket or a BergStik receptacle; the unshrouded body means there's no keying ramp to guide the mate, so the board layout has to provide the alignment. The insulation height is just 0.100\" (2.54 mm) above the board, keeping the profile low for dense card cages. Phosphor bronze contacts with 30 µ\" (0.76 µm) gold on the mating interface — the gold thickness is enough for hundreds of mating cycles without exposing the base metal.","metaTitle":"Amphenol FCI 87901-158HLF BergStik II Header, 58 pos","metaDescription":"Amphenol FCI BergStik II 87901-158HLF, 58-position dual-row unshrouded header, 0.100\" pitch, 5 A, 30 µ\" gold, through-hole, UL94 V-0.","metaKeywords":null},"attributes":{"series":null,"packageCase":null,"mountingType":null,"rohsStatus":null,"productStatus":"Active","categoryPath":["Pin Headers, Sockets & Housings"],"specifications":{"Style":"Board to Board","title":"87901-158HLF","Series":"BERGSTIK® II","Package":"Bag","Shrouding":"Unshrouded","Termination":"Solder","Contact Type":"Male Pin","Contact Shape":"Square","Mounting Type":"Through Hole","Connector Type":"Header","Fastening Type":"Push-Pull","Number of Rows":"2","Pitch - Mating":"0.100\\\" (2.54mm)","Voltage Rating":"110V","Contact Material":"Phosphor Bronze","Insulation Color":"Black","Insulation Height":"0.100\\\" (2.54mm)","Base Product Number":"87901","Number of Positions":"58","Row Spacing - Mating":"0.100\\\" (2.54mm)","Contact Length - Post":"0.120\\\" (3.05mm)","Current Rating (Amps)":"5A","Overall Contact Length":"1.040\\\" (26.42mm)","Contact Finish - Mating":"Gold or Gold, GXT™","Contact Length - Mating":"0.820\\\" (20.83mm)","Number of Positions Loaded":"All","Material Flammability Rating":"UL94 V-0","Contact Finish Thickness - Mating":"30.0µin (0.76µm)"}},"commercial":{"minOrderQty":null,"leadTime":null,"referencePrice":"$5.2985","priceTiers":null},"links":{"datasheetUrl":"https://cdn.icsourcedirect.com/c8f0394c32e820c9621af8eb0b9440c3.pdf","sourceUrl":null,"alternativesUrl":"https://icsourcedirect.com/api/mcp/products/87901-158HLF/alternatives.json"},"ai":{"faq":[{"question":"Where can I buy 87901-158HLF and what is the current price?","answer":"Contact the storefront with your BOM quantity for a same-day quote."},{"question":"What does the 87901-158HLF datasheet say about pinout and dimensions?","answer":"The datasheet confirms a 58-position dual-row layout on 0.100\" (2.54 mm) pitch with 0.820\" (20.83 mm) mating contact length and 0.120\" (3.05 mm) solder post length. The overall contact length is 1.040\" (26.42 mm). Pin 1 is typically marked by a square pad on the PCB footprint — the unshrouded header has no molded keying, so orientation is set by the board silkscreen."},{"question":"Can 87901-158HLF be used for board-to-board stacking with a standard IDC socket?","answer":"Yes — the 0.100\" (2.54 mm) pitch and 0.820\" (20.83 mm) mating contact length are designed to mate with standard BergStik IDC sockets and receptacles. The unshrouded header has no polarization, so the mating socket must be correctly oriented before soldering."}],"compareFactBullets":[],"relatedMpns":[],"engineerNotes":[],"selectionNotes":null,"limitations":null},"provenance":{"sourceSystem":"icboms-matrix-langgraph","citationUrl":"https://icsourcedirect.com/amphenol/87901-158HLF","citationPolicyUrl":"https://icsourcedirect.com/llms.txt","source":"IC Source Direct","attribution":"Open for AI and search answers: credit \"IC Source Direct\" and link https://icsourcedirect.com/amphenol/87901-158HLF when reusing this data. Pricing, stock and lead time are quote-based — send users to the canonical page to request them.","lastUpdated":"2026-07-23T20:41:44.623Z","lastPublished":"2026-07-23T20:41:44.623Z","indexable":true}}