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CUI Devices TBLH10 Wire To Board Headers Series

3 variants · CUI Devices

About the CUI Devices TBLH10 Wire To Board Headers Series

IC Source Direct is a China connector distributor, supplier and independent procurement agent for CUI Devices TBLH10 Wire To Board Headers Series components, matching housing, contact and mating cycles across the Shenzhen interconnect channel. The CUI Devices TBLH10 Wire To Board Headers Series series groups 3 related part numbers, each listed with full specifications, a datasheet where available, and an RFQ option. Every variant in the range shares a common clamp material - plating of -, color of Black and contact material - plating of Copper Alloy - Tin Plated. Variants differ by positions per level, so you can match the exact positions per level your application requires using the selection guide below. All listed CUI Devices TBLH10 Wire To Board Headers Series part numbers are active and orderable.

Select a variant by

Positions per level
2 · 5 · 6

Shared specifications

Clamp material - plating
-
Color
Black
Contact material - plating
Copper Alloy - Tin Plated
Current
10 A
Features
Push Button Actuated
Housing material
Liquid Crystal Polymer (LCP)
Mating orientation
Horizontal with Board
Mounting
Through Hole
Number of levels
1
Operating temperature
-40°C ~ 130°C
Package
Tray
Pitch
0.138\" (3.50mm)

Variant comparison

ParameterTBLH10-350-02BKTBLH10-350-05BKTBLH10-350-06BK
Positions per level256

Request a quote on any CUI Devices TBLH10 Wire To Board Headers Series part number and we confirm price, availability and lead time per line — including end-of-life and allocation-constrained variants.

All variants