A factory-floor buyer's view of the 2026 Single Pair Ethernet migration: HMS Networks' 8-of-10 industrial-Ethernet figur...
TE Connectivity, Amphenol and Molex OSFP and QSFP-DD cage and receptacle supply in Q3 2026, with NVIDIA Vera Rubin NVL72...
Compact wire-to-board demand at 1.25 mm and 2.00 mm pitch is being pulled forward by EV battery management, industrial I...
Harting Han-Modular, Han E, Han A, Han B and Han Q heavy-duty inserts plus TE Connectivity M12 D-coded rail connectors a...
How JST's $500M Guntersville automation plant reshapes PH, XH, SH, GH and ZH wire-to-board connector supply, lead times ...
In 2026 the 0.100" (2.54 mm) signal-header and IDC ribbon-cable interconnect family is back under pressure from PCB shor...
Koch-owned Molex signed a 10-year, €5.5 billion (US$6.29 billion) supply agreement with Prysmian in July 2026 to wire hy...
Amphenol HD-BNC and 75 ohm BNC sourcing for broadcast, OB-van, and stadium AV buyers in 2026: LA28 IBC, FIFA 2026, and t...
Molex launched the 25 Gbps HSAutoLink G automotive Ethernet connector on June 30, 2026, raising the ceiling for software...
How 800 VDC rack architecture and liquid-cooled busbar announcements from TE Connectivity and Molex in mid-2026 are resh...