0566-2-15-01-21-02-10-0
Mill-Max Manufacturing Corp.
0566BulkSolder
Ref. price$1.1400
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Mill-Max Manufacturing Corp. 0566 Series
2 variants · Mill-Max Manufacturing Corp.
About the Mill-Max Manufacturing Corp. 0566 Series
IC Source Direct is a China connector distributor, supplier and independent procurement agent for Mill-Max Manufacturing Corp. 0566 Series components, matching housing, contact and mating cycles across the Shenzhen interconnect channel. The Mill-Max Manufacturing Corp. 0566 Series series groups 2 related part numbers, each listed with full specifications, a datasheet where available, and an RFQ option. Every variant in the range shares a common accepts pin diameter of 0.015\" ~ 0.022\" (0.38mm ~ 0.56mm), accepts square pin size of - and board thickness of -. Variants differ by contact finish, contact finish thickness and socket depth, so you can match the exact contact finish your application requires using the selection guide below. All listed Mill-Max Manufacturing Corp. 0566 Series part numbers are active and orderable.
Select a variant by
- Contact finish
- Gold · Tin-Lead
- Contact finish thickness
- 10.0µin (0.25µm) · 100.0µin (2.54µm)
- Socket depth
- 0.083\" (2.11mm) · 0.138\" (3.51mm)
Shared specifications
- Accepts pin diameter
- 0.015\" ~ 0.022\" (0.38mm ~ 0.56mm)
- Accepts square pin size
- -
- Board thickness
- -
- Contact material
- Beryllium Copper
- Features
- -
- Flange diameter
- 0.058\" (1.47mm)
- Insertion force
- -
- Length - overall
- 0.138\" (3.51mm)
- Mounting hole diameter
- 0.039\" (0.99mm)
- Operating temperature
- -55°C ~ 125°C
- Package
- Bulk
- Pin hole diameter
- 0.031\" (0.79mm)
Variant comparison
| Parameter | 0566-2-15-01-21-02-10-0 | 0566-2-15-15-21-14-10-0 |
|---|---|---|
| Contact finish | Tin-Lead | Gold |
| Contact finish thickness | 100.0µin (2.54µm) | 10.0µin (0.25µm) |
| Socket depth | 0.138\" (3.51mm) | 0.083\" (2.11mm) |
Request a quote on any Mill-Max Manufacturing Corp. 0566 Series part number and we confirm price, availability and lead time per line — including end-of-life and allocation-constrained variants.