Board Layout Fit: 0.100" Pitch, 20 Positions, Dual Row
The 0010897202: The 2.54 mm pitch matches standard 0.100-inch grid prototyping boards and is the dominant pitch for general-purpose wire-to-board and board-to-board interconnects. With 20 positions loaded across two rows, the connector occupies a 10-position-per-row footprint — the row spacing is also 0.100" (2.54 mm), so the overall board footprint is 10 pins wide by 2 rows deep. The total contact length of 0.437" (11.10 mm) gives the pin enough reach to mate with a standard receptacle or a second board in a stacking configuration.
Mating Interface and Plating Grade
The post tails are tin-plated (74.8 µinch) for solderability with standard lead-free processes. This is common in breakaway headers where the user snaps off the desired pin count from a longer strip.
Application Range and Compliance
The LCP glass-filled insulation material handles reflow temperatures and provides dimensional stability in humid environments.