The 0010897342: 34 positions in two rows on 2.54 mm pitch — the same grid as legacy 0.100-inch DIP packages, so the footprint routes cleanly on two-layer boards without via congestion. Unshrouded header, breakaway construction: snap to the needed circuit count, or use all 34.
Through-Hole Retention and Solder Process
Tin-plated posts (74.8 µinch) wet reliably with SnPb or SAC alloys. Insulation height of 0.090 inch leaves clearance under the header for trace routing; the LCP housing withstands lead-free reflow temperatures without distortion.
Flammability and Application Range
Listed applications include automotive, general purpose, lighting, medical, and telecommunications.