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Molex 0015916506 — Pin Headers, Sockets & Housings

Molex C-Grid 71308 0015916506 Header, 50-Pos 2.54mm

MPN0015916506
Active

Molex C-Grid 71308 header, breakaway, order code 0015916506, 50 positions, dual row, 0.100" (2.54 mm) pitch, gold-plated mating contacts, 30.0µin (0.76µm) thickness, surface-mount, solder termination, unshrouded, UL94 V-0.

$9.5508Ref. price · indicative, final on quote
Source DocumentedChannel stated on listing & quote
Condition PhotosReal unit photos / video on request
WhatsApp AnswersFast human replies for stock & sourcing questions
Worldwide DispatchDHL/FedEx — transit quoted per order
Independent supplier — new & surplus connector stock· Listing updated Aug 2026

Specifications

0015916506 key specifications
ParameterValue
SeriesC-Grid 71308
TypeMale Pin
MountingSurface Mount
Connector typeHeader, Breakaway
Fastening typePush-Pull
Contact materialCopper Alloy
Insulation colorBlack
Insulation height0.090\" (2.29mm)
Insulation materialLiquid Crystal Polymer (LCP), Glass Filled
Material flammability ratingUL94 V-0
StyleBoard to Board or Cable
FeaturesBoard Guide, Pick and Place

All specifications

0015916506 additional specifications
ParameterValue
PackageTape & Reel (TR)
ShroudingUnshrouded
TerminationSolder
Contact shapeSquare
Rows2
Pitch0.100\" (2.54mm)
Positions50
Row spacing - mating0.100\" (2.54mm)
Contact finish - postTin
Contact finish - matingGold
Contact length - mating0.240\" (6.10mm)
Contact finish thickness - mating30.0µin (0.76µm)

Product details

Breakaway header for board-to-board or cable duty

The 0015916506 is the 50-position member of Molex's C-Grid 71308 breakaway header line, designed for board-to-board or cable interconnect. Gold-plated mating contacts at 30.0µin (0.76µm) thickness suit repeated mating cycles; the unshrouded push-pull fastening and 0.090" (2.29 mm) insulation height keep the profile low on the board.

Board layout and footprint fit

Dual-row layout at 0.100" (2.54 mm) pitch with 0.100" (2.54 mm) row spacing — the footprint matches standard 0.100" grid patterns for routing density. The 0.240" (6.10 mm) mating pin length provides enough stand-off for wire-to-board or board-to-board stacking within the same series. A board guide and pick-and-place feature aid automated SMT assembly; the LCP, glass-filled insulation carries UL94 V-0 and holds up to reflow.