Molex 0022284300 KK254 Header 30-Position 2.54mm Pitch
Molex 0022284300, KK254 series, single-row unshrouded breakaway header, 30 positions, 0.100" (2.54mm) pitch, tin-plated square male contacts, push-pull fastening, through-hole solder termination, UL94 V-0 glass-filled polyamide housing, 0.090" (2.29mm) insulation height, bulk package.
Specifications
| Parameter | Value |
|---|---|
| Series | KK254, 42375 |
| Type | Male Pin |
| Mounting | Through Hole |
| Connector type | Header, Breakaway |
| Fastening type | Push-Pull |
| Insulation color | Black |
| Insulation height | 0.090\" (2.29mm) |
| Insulation material | Polyamide (PA), Nylon, Glass Filled |
| Material flammability rating | UL94 V-0 |
| Style | Board to Board or Cable |
| Package | Bulk |
| Shrouding | Unshrouded |
All specifications
| Parameter | Value |
|---|---|
| Termination | Solder |
| Applications | Automotive, General Purpose, Medical, Telecommunications |
| Contact shape | Square |
| Rows | 1 |
| Pitch | 0.100\" (2.54mm) |
| Positions | 30 |
| Contact finish - post | Tin |
| Contact length - post | 0.125\" (3.18mm) |
| Overall contact length | 0.455\" (11.56mm) |
| Contact finish - mating | Tin |
| Contact length - mating | 0.240\" (6.10mm) |
| Contact finish thickness - post | 100.0µin (2.54µm) |
| Contact finish thickness - mating | 100.0µin (2.54µm) |
Frequently asked questions
What series does the 0022284300 belong to?
The 0022284300 is part of the Molex KK254 series (42375 series designation) — a 30-position single-row unshrouded breakaway header on 0.100" (2.54 mm) pitch with through-hole solder termination.
What connector style is the 0022284300 listed as?
The listed style is Board to Board or Cable, meaning it is designed for board-to-board or board-to-wire signal and light-power interconnect applications rather than panel or wire-to-wire harness use.
What is the contact plating on the 0022284300 and does it matter for my application?
Both the mating face and the solder tail carry tin plating at 100.0 µin (2.54 µm) — standard commercial grade for the series. This is adequate for signal and low-power duties in fixed-installation environments; for high-cycle field reconnection, gold plating from a variant in the same series would be the appropriate upgrade.