4-Position Micro-Fit 3.0 Power Header
The Molex 0430450483 is a 4-circuit, dual-row header from the Micro-Fit 3.0 43045 series, on a 3.00 mm pitch. It is a board-to-wire interconnect, designed for applications in automotive, industrial, medical, and telecom equipment where a compact, high-current connection is needed. The header is shrouded on all four walls and uses a locking ramp for secure mating in environments subject to vibration.
Key Ratings and What They Mean for Your Design
Rated 8 A per circuit at 600 V, this header carries enough current for a moderate-power rail or multiple signal lines without needing a larger connector. The 3.00 mm pitch provides adequate creepage distance for the 600 V rating while keeping the board footprint compact. Tin plating on both the mating and post surfaces (60.0 µin) is a cost-effective choice for applications with a moderate number of mating cycles; it is well-suited for internal harness connections where the connector is mated during assembly and rarely disconnected in the field.
Mechanical and Environmental Fit
The through-hole, kinked-pin termination provides a robust solder joint that resists shear forces from cable strain. The locking ramp and 4-wall shroud protect the contacts and prevent accidental unmating.