Micro-Fit 3.0 Header for Wire-to-Board Power
The Molex 0430450827 is an 8-circuit, dual-row header from the Micro-Fit 3.0 43045 series, designed for board-to-cable/wire interconnects. It uses a 3.00 mm pitch on both the mating interface and row spacing, which sets the board footprint for a 2x8 layout. Rated at 8 A per circuit at 600 V, this header handles moderate power distribution in a compact package. The through-hole solder termination and shrouded 4-wall housing with a locking ramp make it a reliable choice for vibration-prone environments like automotive and industrial equipment.
Key Specs and What They Mean for the Fit
The 3.00 mm pitch is the first thing to check against your board layout — it determines the pad spacing and routing channel width. The 8 A per circuit rating is the maximum current each pin can carry continuously at 25 °C; derate for higher ambient temperatures per the product drawing. Tin plating on the mating contacts (60.0 µin) provides good corrosion resistance and is cost-effective for moderate mating cycle counts — think harness assemblies that mate a few times over their service life, not daily field disconnects. The locking ramp engages with the matching receptacle's latch to resist vibration-induced separation, a key requirement in automotive and industrial applications.
Where It's Used and What It Mates With
This header is listed for automotive, general purpose, industrial, medical, and telecommunications applications — a broad scope that reflects the Micro-Fit 3.0 family's versatility. It mates with the matching Micro-Fit 3.0 receptacle housing (sold separately) that accepts crimp terminals for 20-24 AWG wire. The shrouded 4-wall design protects the male pins during handling and guides alignment during mating. The UL94 V-0 rated LCP housing suits equipment requiring flame-rated components inside an enclosure.