Micro-Fit 3.0 SMT Header for Board-to-Wire Power
The Molex 0430451415 is a 14-circuit, dual-row header from the Micro-Fit 3.0 43045 series, designed for board-to-wire power interconnects. Rated at 8 A per circuit and 600 V, it handles moderate power distribution in a compact SMT package. This header is specified for use in automotive, general purpose, industrial, medical, and telecommunications equipment, reflecting its broad application range. The UL94 V-0 rated LCP housing provides the flame resistance required for equipment inside enclosures.
Termination is SMT solder — the header is placed on the board and reflowed. The board lock features are integral to the housing, so no separate hardware is needed for retention during assembly.