Board-to-Wire Power Header for Dense SMT Layouts
The Molex 0430451811 is an 18-circuit, dual-row header from the Micro-Fit 3.0 43045 series, designed for board-to-wire power interconnects. The locking ramp fastening provides a positive, vibration-resistant hold when mated with the matching Micro-Fit 3.0 receptacle housing. This connector is specified for use in automotive, general purpose, industrial, medical, and telecommunications equipment.
The 3.00 mm pitch and 0.118" row spacing give adequate creepage for the 600 V rating without forcing an oversized board footprint. The solder retention feature on the SMT tails improves the joint's resistance to shear forces from cable strain and vibration during thermal cycling — a practical advantage over a plain SMT footprint.
This header mates with Micro-Fit 3.0 receptacle housings (such as the 43025 series) that accept crimp terminals for 20-24 AWG wire. The shrouded 4-wall design prevents bent pins during blind mating and provides keying against incorrect insertion.