Micro-Fit 3.0 header for wire-to-board power
The Molex 0430451829 is an 18-circuit dual-row header from the Micro-Fit 3.0 43045 series, designed for board-to-cable/wire power interconnects. It uses a 0.118" (3.00mm) pitch, with the male square pins arranged in two rows spaced at the same 0.118" (3.00mm) row pitch. Rated at 8A per circuit at 600V, this header carries genuine power-level current — sized for DC rails and distribution within the harness, not just signal lines. The through-hole solder termination and the board guide feature simplify alignment during PCB assembly.
The 0.118" (3.00mm) pitch and 0.118" (3.00mm) row spacing define the PCB footprint — the 18 positions in a 2x9 grid. The 8A per circuit rating is the per-contact limit at the connector; derating above the 105°C operating ceiling follows the standard curve. The 30.0µin gold on the mating side, not the tin-plated solder tails (100.0µin (2.54µm) tin on the post), is what governs the real duty cycle for repeated matings — gold on the contact interface avoids fretting corrosion in high-vibration or field-service applications.