20-Circuit Micro-Fit 3.0 Header for Wire-to-Board Power Distribution
The Molex 0430452029 is a 20-circuit, dual-row header in the Micro-Fit 3.0 43045 series, designed for board-to-cable/wire power interconnects. Rated 8 A per circuit at 600 V, this header handles moderate power distribution — the 3.00 mm pitch provides enough creepage for the 600 V rating without an oversized board footprint. The gold-plated mating contacts (30.0 µ" / 0.76 µm) are suited for repeated mating cycles and corrosive environments, while the tin-plated solder tails (100.0 µ" / 2.54 µm) provide a reliable through-hole solder joint.
The dual-row footprint at 3.00 mm row spacing matches the standard Micro-Fit 3.0 layout, so board layout is consistent across the series.