The Molex 0430452429 is a 24-circuit, dual-row header from the Micro-Fit 3.0 43045 series. The 0.118" (3.00 mm) mating pitch matches the standard Micro-Fit 3.0 receptacle footprint, and the 8 A per-circuit rating with 600 V withstand delivers headroom for power distribution in harness assemblies. Gold plating on the mating contacts at 30.0 µin (0.76 µm) provides corrosion resistance and supports repeated mating cycles in field-serviceable connections. The through-hole solder termination and board guide simplify alignment during assembly, while the UL94 V-0 liquid crystal polymer housing handles the temperature range from -40°C to 105°C without degradation.
The 24 positions at 3.00 mm pitch on two rows give a board footprint that matches the standard Micro-Fit 3.0 receptacle layout — verify your PCB land pattern against the 0.118" row spacing. The 8 A per circuit is a per-contact rating at the connector level; derate current above 105°C ambient per the manufacturer's curve. The 30.0 µin gold mating finish is what buys you 50+ mating cycles in a corrosive or high-vibration environment — tin would fret and oxidise under the same duty.
This header mates with the matching Micro-Fit 3.0 receptacle housing (e.g., the 43025 series) using crimp terminals. The locking ramp provides audible feedback on full engagement. The through-hole solder tails are 0.125" (3.18 mm) long, tin-plated for solderability, and the square pins accept the receptacle's box-type contact.