Molex Micro-Fit 3.0 43650 series header, SMD right-angle, 3 positions, 3.00 mm pitch, 30.0 µinch gold mating finish, locking ramp, UL94 V-0 LCP housing, ROHS3 compliant.
| Parameter | Value |
|---|---|
| Series | Micro-Fit 3.0 43650 |
| Type | Male Pin |
| Mounting | Surface Mount, Right Angle |
| Connector type | Header |
| Fastening type | Locking Ramp |
| Contact material | Brass |
| Insulation color | Black |
| Insulation height | 0.172\" (4.37mm) |
| Insulation material | Liquid Crystal Polymer (LCP), Glass Filled |
| Material flammability rating | UL94 V-0 |
| Style | Board to Cable/Wire |
| Package | Tape & Reel (TR) Cut Tape (CT) |
| Parameter | Value |
|---|---|
| Features | Solder Retention |
| Shrouding | Shrouded - 4 Wall |
| Termination | Solder |
| Applications | General Purpose, Medical, Military, Telecommunications |
| Contact shape | Square |
| Rows | 1 |
| Pitch | 0.118\" (3.00mm) |
| Positions | 3 |
| Contact finish - post | Tin |
| Contact finish - mating | Gold |
| Contact finish thickness - post | 100.0µin (2.54µm) |
| Contact finish thickness - mating | 30.0µin (0.76µm) |
The 0436500314: This header mates with a Micro-Fit 3.0 receptacle housing (e.g., 043650 series) that accepts the matching crimp terminal. Termination is solder — the SMT tails are designed for reflow assembly.
The right-angle SMD package frees board area behind the connector for other components. Insulation height is 0.172" (4.37 mm) above the board surface; the mated receptacle adds height on top of that. Use the product drawing for exact keep-out dimensions.
The mating half is a Micro-Fit 3.0 receptacle housing (same 43650 series) that accepts the matching crimp terminal. The locking ramp on this header engages the receptacle latch for a secure, vibration-resistant connection.