3.00 mm Pitch, 8-Position Single-Row Shrouded Header
The 0436500824 is an 8-position single-row shrouded header from the Molex Micro-Fit 3.0 43650 series. The header is designed for board-to-cable/wire applications, mating with a crimp-terminal receptacle housing to form a wire-to-board interconnect. A locking ramp secures the header to the receptacle, preventing disengagement under cable strain or vibration — important for harnesses in moving assemblies. The contacts are tin-plated with a thickness of 100.0 µinch (2.54 µm) — a heavy-duty finish suitable for moderate mating cycles (50-100) in dry environments. The solder tails are also tin-plated. The header terminates via surface-mount soldering and includes solder retention features to anchor the part during reflow, reducing tombstoning and shear stress from cable pull. The insulation height is 0.390" (9.91 mm).
SMT Termination and Tape & Reel Packaging
The SMT solder tails are tin-plated. The solder retention features provide additional board-level hold during reflow.