Molex Micro-Fit 3.0 header, order code 0436501118, 11 positions, single row, 0.118" (3.00mm) pitch, tin-plated mating contacts, through-hole, kinked pin solder termination.
| Parameter | Value |
|---|---|
| Series | Micro-Fit 3.0 43650 |
| Type | Male Pin |
| Mounting | Through Hole |
| Connector type | Header |
| Fastening type | Locking Ramp |
| Contact material | Brass |
| Insulation color | Black |
| Insulation height | 0.390\" (9.91mm) |
| Insulation material | Liquid Crystal Polymer (LCP), Glass Filled |
| Mated stacking heights | 17.56mm |
| Material flammability rating | UL94 V-0 |
| Style | Board to Cable/Wire |
| Parameter | Value |
|---|---|
| Package | Tray |
| Features | Board Lock |
| Shrouding | Shrouded - 4 Wall |
| Termination | Kinked Pin, Solder |
| Applications | General Purpose, Medical, Military, Telecommunications |
| Contact shape | Square |
| Rows | 1 |
| Pitch | 0.118\" (3.00mm) |
| Positions | 11 |
| Contact finish - post | Tin |
| Contact length - post | 0.125\" (3.18mm) |
| Contact finish - mating | Tin |
| Contact finish thickness - mating | 100.0µin (2.54µm) |
The 0436501118 is the 11-circuit member of Molex's Micro-Fit 3.0 43650 header line, a shrouded single-row board-to-wire header with a locking ramp for positive retention. Tin-plated mating contacts at 0.118" (3.00mm) pitch suit moderate-cycle applications where gold is not required; the through-hole kinked pin termination provides mechanical retention before soldering.