0.40 mm pitch, 80 positions, 1.5 mm stack — board-to-board mezzanine for tight z-height
The Molex 0513380874 is an 80-position receptacle from the SlimStack 51338 series, designed for parallel board-to-board mezzanine stacking. At a 0.016" (0.40mm) pitch across two rows, this connector packs 80 I/O into a board footprint roughly 16 mm long — forcing an HDI board design with fine trace escapes between pads. The mated stacking height of 1.5 mm is the lowest in the 51338 family, which means the component height on both the top and bottom board must stay under that gap, and airflow clearance in the enclosure is minimal.
Mating half and footprint planning
This receptacle mates with the corresponding SlimStack 51338 header (same series, 0.40 mm pitch, 80 positions, 2 rows). The header is the male half with the same 1.5 mm mated stack height — order both halves as a matched pair for the mezzanine interconnect. The SMT footprint requires a solder paste stencil with apertures sized for the 0.40 mm pitch pads; the solder retention tabs need their own paste deposits for proper reflow wetting.