Gold Flash Mating — Low-Cycle, Cost-Effective
For repeated field-service mating, a thicker gold (15 µinch or more) would be specified. The post finish is tin, standard for solder-joint reliability with the SMT reflow process.
At 1.25 mm pitch, the board layout needs a trace width and spacing that fits between adjacent pads — typically 0.3 mm traces with 0.25 mm clearance on a standard 1 oz copper layer.
