2.00mm Pitch, 18-Circuit MicroClasp Header
Through-Hole Solder with Kinked Pins
Mated stack height is 13.2mm — this is the z-height from the board surface to the mating interface, a dimension that must fit the enclosure clearance.
Housing Material and Flame Rating
Contact material is brass, square pin shape, all 18 positions loaded — no unpopulated positions on this variant.
