Board-fit and contact system
The 0702800676: Row spacing matches the pitch at 0.100" (2.54mm). Post contacts receive a tin finish (74.8µin / 1.90µm); the black LCP housing is glass-filled and rated UL94 V-0.

Molex C-Grid 70280 header, breakaway, order code 0702800676, 16 positions, dual row, 0.100" (2.54mm) pitch, through hole, solder termination, gold mating contact finish, UL94 V-0.
| Parameter | Value |
|---|---|
| Series | C-Grid 70280 |
| Gender | Male Pin |
| Mounting type | Through Hole |
| Connector type | Header, Breakaway |
| Fastening type | Push-Pull |
| Contact material | Copper Alloy |
| Insulation color | Black |
| Insulation height | 0.090\" (2.29mm) |
| Insulation material | Liquid Crystal Polymer (LCP), Glass Filled |
| Material flammability rating | UL94 V-0 |
| Style | Board to Board or Cable |
| Package | Bulk |
| Shrouding | Unshrouded |
| Termination | Solder |
| Applications | Automotive, General Purpose, Lighting, Medical, Telecommunications |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.100\" (2.54mm) |
| Positions | 16 |
| Row spacing - mating | 0.100\" (2.54mm) |
| Contact finish - post | Tin |
| Contact length - post | 0.175\" (4.45mm) |
| Overall contact length | 0.505\" (12.83mm) |
| Contact finish - mating | Gold |
| Contact length - mating | 0.240\" (6.10mm) |
| Contact finish thickness - post | 74.8µin (1.90µm) |
| Contact finish thickness - mating | 30.0µin (0.76µm) |
The 0702800676: Row spacing matches the pitch at 0.100" (2.54mm). Post contacts receive a tin finish (74.8µin / 1.90µm); the black LCP housing is glass-filled and rated UL94 V-0.
It is listed as a Board to Board or Cable style header, meaning it can interconnect two PCBs or mate with a crimp-housing receptacle for wire-to-board applications.
It belongs to the Molex C-Grid 70280 series, a family of 0.100" pitch breakaway headers and receptacles.
The insulator carries a UL94 V-0 flammability rating. RoHS and REACH compliance are standard for the series; specific certificates are available upon request with an RFQ.