Board-to-Board Mezzanine Connector for Dense Stacking
It uses a 0.039" (1.00mm) pitch across two rows, which keeps the board footprint compact while supporting 64 signal or low-power lines between stacked PCBs.
This receptacle sits 0.327" (8.30mm) above the board surface and is specified for a mated stacking height of 13mm. That 13mm gap between the two PCBs is the dimension you design the enclosure standoffs around. The 8.30mm profile on the receptacle side leaves room for passives or a low-profile component on the underside of the top board, as long as the total stack-up clears the 13mm envelope.
Contact Plating and Signal Duty
The gold finish also suits low-level signal applications where tin plating could oxidise and introduce noise.
Surface Mount Termination
The board guide helps locate the part on the pads before reflow, and the outer shroud adds rigidity to the SMT joint once soldered. Tube packaging keeps the parts oriented for pick-and-place feeders.