Molex C-Grid 71764 series, 0717640106, 6-position dual-row unshrouded breakaway header, 0.100" (2.54mm) pitch, right-angle through-hole, gold-plated mating contacts, tin-plated posts, UL94 V-0 black thermoplastic housing.
| Parameter | Value |
|---|---|
| Series | C-Grid 71764 |
| Type | Male Pin |
| Mounting | Through Hole, Right Angle |
| Connector type | Header, Breakaway |
| Fastening type | Push-Pull |
| Contact material | Copper Alloy |
| Insulation color | Black |
| Insulation height | 0.200\" (5.08mm) |
| Insulation material | Thermoplastic |
| Material flammability rating | UL94 V-0 |
| Style | Board to Board or Cable |
| Package | Bulk |
| Parameter | Value |
|---|---|
| Shrouding | Unshrouded |
| Termination | Solder |
| Applications | Automotive, General Purpose, Lighting, Medical, Telecommunications |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.100\" (2.54mm) |
| Positions | 6 |
| Row spacing - mating | 0.100\" (2.54mm) |
| Contact finish - post | Tin |
| Contact length - post | 0.110\" (2.79mm) |
| Contact finish - mating | Gold |
| Contact length - mating | 0.240\" (6.10mm) |
| Contact finish thickness - post | 74.8µin (1.90µm) |
| Contact finish thickness - mating | 15.0µin (0.38µm) |
The post finish is 74.8 µinch tin, standard for solder-joint reliability in through-hole wave-solder assembly. The insulation height of 0.200" (5.08mm) leaves clearance for component placement on the board under the header body.
It is ROHS3 compliant.
This is the standard 0.100" grid footprint used across the C-Grid 71764 series.
Availability and current pricing confirmed at quote time.