12-Position Breakaway Header – Board-to-Board or Cable Interconnect
The 090122-0766: This is a 12-position, 2-row breakaway header from the Molex C-Grid III 90122 series. The header is unshrouded, meaning the pins are exposed without a plastic wall. This gives flexibility in mating depth and orientation, but the mating half must provide its own alignment – typically a polarized housing with a chamfered entry.
Gold Mating Finish for Repeated Connect-Disconnect Duty
This gold layer resists oxidation and fretting corrosion, supporting a higher number of mating cycles than a tin-plated equivalent – a practical choice for field-service connections or test-point headers. The solder tails carry a 118.1 µinch (3.00 µm) tin finish. The thick tin layer ensures good wetting during wave soldering and a reliable fillet in the plated through-hole.
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Mating Half and Application Environment
This header mates with C-Grid III crimp-socket housings (e.g., the 90123 series) for wire-to-board connections, or with IDC receptacles for ribbon-cable assemblies. The polyester, glass-filled material holds up to typical soldering and reflow temperatures. Applications include automotive and general-purpose electronics – the header can carry signal-level currents in control modules, sensors, or board-to-board interconnects within the C-Grid III current rating.