Its defining spec is the 0.014" (0.35 mm) pitch — fine enough to pack 32 positions into a compact footprint, but tight enough that routing between pads demands careful trace width planning. The plug carries outer shroud contacts and mates with a matching receptacle to achieve a 0.6 mm mated stacking height, suited for thin-profile portable devices, module stacking, or high-density parallel bus interconnects where every millimeter of z-height counts.
The 0.35 mm pitch drives the board footprint — expect fine-pitch SMT pads with tight clearance for trace escape routing between rows. The 0.020" (0.50 mm) height above board and 0.6 mm mated stack height set the mezzanine gap; verify this matches your board-to-board clearance before layout.
Mating and Stacking
The plug is surface-mount only — no through-hole variant in this series.