Board-fit and routing: 2.00 mm pitch, right-angle SMT
Solder retention and reflow behaviour
The header includes solder retention features that hold it in place during SMT reflow — no secondary hand-soldering or through-hole staking is needed. The surface-mount solder tails are tin-bismuth plated, compatible with standard lead-free reflow profiles. Insulation is black polyamide (PA, nylon) rated UL94 V-0 — the housing will not propagate flame inside the equipment enclosure.
Mating half and wire-gauge flexibility
This header mates with a Molex 217064-series receptacle housing that accepts crimp terminals.
