Micro-Fit 3.0 SMT Header, 4 Circuits, 3.00 mm Pitch
The Molex 430450416 is a 4-circuit, dual-row SMT header from the Micro-Fit 3.0 43045 series, on a 3.00 mm pitch. It's a board-to-wire interconnect — the header solders to the PCB and mates with a Micro-Fit 3.0 receptacle housing that terminates the wire harness. The 8 A per circuit rating at 600 V gives it headroom for power distribution in automotive, industrial, medical, and telecom gear, not just signal duty. The 4-wall shrouding protects the 0.118" (3.00 mm) square pins during mating and prevents bent contacts in a blind-mate scenario.
Board Lock and SMT Retention
The board lock feature is a pair of metal barbs that press into the PCB during placement and hold the header in place through the reflow oven. Without it, the 9.91 mm (0.390") tall insulator would be top-heavy and prone to tombstoning or shifting before the solder solidifies. The board lock also takes shear force from cable strain after the mating half is latched, so the solder joints aren't the only thing resisting a yank.
