Micro-Fit 3.0 SMT Header for Board-to-Wire Power
The Molex 430450617 is a 6-position, dual-row shrouded header from the Micro-Fit 3.0 43045 series, designed for board-to-cable/wire interconnects. Rated at 8 A per circuit and 600 V, with gold plating (30.0 µin) on the mating contacts, it suits power distribution in automotive, industrial, medical, and telecom equipment where vibration resistance and reliable current delivery are needed.
The 3.00 mm pitch is the defining footprint dimension for the Micro-Fit 3.0 family — it dictates the PCB layout and ensures compatibility with the full range of Micro-Fit 3.0 receptacle housings.
This header mates with any standard Micro-Fit 3.0 receptacle housing (e.g., 43025 series) that uses the 3.00 mm pitch, 6-circuit, dual-row layout. The locking ramp provides audible positive retention — a field technician will hear it latch. The surface-mount termination is compatible with standard reflow profiles; the board locks keep the part aligned during solder paste reflow.
