The Molex 430450623 is a 6-circuit, dual-row right-angle header from the Micro-Fit 3.0 43045 series. It mates with the matching Micro-Fit 3.0 receptacle housing to form a board-to-wire power interconnect.
The tin solder tails (100 µ"/2.54 µm) are standard for wave-solder wetting. The UL94 V-0 LCP housing handles the 105°C upper end of the operating range without softening.
Typical Applications and Environments
Molex lists this header for automotive, general-purpose industrial, medical, and telecommunications equipment. The 8 A, 600 V rating also suits it for power distribution inside a PSU or industrial controller.
The 3.00 mm pitch gives you enough room between pins for 600 V creepage without forcing a huge board footprint — standard 0.062" FR-4 handles it fine. The 8 A per circuit is the headline number, but that's at 25°C ambient; derate it above that per the Micro-Fit 3.0 derating curve. The dual-row 0.118" row spacing means the through-hole pattern takes up about 0.290" (7.37 mm) of board height from the solder side — check your keep-out zone if you're stacking boards tight.