The Molex 430450627 is a 6-position dual-row header from the Micro-Fit 3.0 43045 series, designed for board-to-wire power and signal interconnects. Rated 8 A per contact at 600 V, with tin-plated square pins and a through-hole solder termination, this header is specified for automotive, industrial, medical, and telecom applications where the -40°C to 105°C operating range and UL94 V-0 housing cover the enclosure requirements.
The 3.00 mm pitch is the standard Micro-Fit 3.0 spacing — it matches the full family of receptacle housings and crimp terminals, so your board footprint is fixed once you pick this series. 8 A per contact at 600 V is the headline rating, but the limiting factor in practice is the temperature rise through the tin-plated contact interface: derate current above 25°C ambient per the manufacturer's curve, especially if you populate all 6 positions in a confined enclosure.
This header mates with any Micro-Fit 3.0 6-circuit dual-row receptacle housing — the standard order code for the mating half is the 43025 series (e.g., 430250600 for the housing, plus the 43030 series crimp terminals for 20-24 AWG wire). The through-hole solder tails are 0.125" (3.18 mm) long, sized for standard 1.6 mm PCBs. No secondary terminal position assurance (TPA) is required on the header side — the TPA goes in the receptacle housing to lock the crimp terminals.