8-Position Dual-Row Header for Wire-to-Board Power
The Molex 430450814 is the 8-circuit, dual-row member of the Micro-Fit 3.0 43045 series, a shrouded header designed for board-to-wire power interconnects. It carries 8 positions loaded on a 3.00 mm pitch with a row spacing of 0.118 in (3.00 mm), suiting it for harness-to-board applications in automotive, industrial, medical, and telecom equipment. The 4-wall shrouded housing with a locking ramp provides positive retention against vibration, while the gold-plated mating interface (30.0 µin / 0.76 µm) and tin solder-post finish (100.0 µin / 2.54 µm) balance corrosion resistance in the connection with reliable solder-joint formation.
The 8 A per-contact current rating at 600 V is the headline power spec — at this pitch and circuit density, the 8 A figure is the practical thermal limit through the LCP housing (UL94 V-0 rated) before temperature rise becomes a concern.
Termination is a kinked through-hole solder pin — the kink provides retention during wave-solder before the joint solidifies. The post length of 0.125 in (3.18 mm) is a standard through-hole depth that fits most 1.6 mm PCBs without bottom-side protrusion issues.