What this header is
The Molex 430451014 is the 10-circuit member of the Micro-Fit 3.0 43045 series — a board-to-cable power header rated 8 A per circuit at 600 V, with a dual-plating contact finish: gold on the mating face for wear resistance across repeated matings, and 100 µin (2.54 µm) tin on the solder tail for reliable through-hole solder wetting. The housing is glass-filled LCP rated UL94 V-0; the four-wall shroud and locking ramp keep the mated pair locked under vibration. Board guides align the header during assembly so the kinked-pin solder tails seat correctly before wave or hand soldering.
Plating split — why it matters
Gold (30.0µin / 0.76µm) on the mating side governs cycle life; tin (100.0µin / 2.54µm) on the post is a solderability finish. The connector is rated 8 A per circuit at 600 V — the dielectric ceiling is the decision point for industrial and telecom power rails.
Where the class is used
Board-to-cable Micro-Fit 3.0 headers appear in automotive harness interconnects, industrial automation control modules, medical diagnostic equipment, and telecom infrastructure — anywhere a locked, shrouded power header needs to survive repeated mating cycles at moderate current. The 10-circuit dual-row count fits a typical 8+2 power-and-signal distribution node without going to a larger pitch family.
Active production, ROHS3
The 430451014 is Active and ROHS3 Compliant per the official lifecycle record. No successor or cross-reference is listed for this specific order code — the standard in-series sizing path is to move up or down in position count within the 43045 family if the circuit count shifts. Quoted to order against BOM quantity; confirm the mating half (the matching Micro-Fit 3.0 receptacle housing and crimp terminal) is also live before committing the pair to the build.