The Molex 430451424 is a 14-circuit, dual-row header from the Micro-Fit 3.0 43045 series, designed for board-to-cable/wire power interconnects.
The tin-plated mating finish (60.0 µin thick) is a workhorse choice: it handles the current duty well, but the mating cycle life is lower than gold-plated alternatives, so this is a fit-and-forget interconnect rather than a frequent-disconnect point.
Through-hole mounting with kinked, tin-plated solder posts (0.125" post length). The kinked pins provide retention during wave soldering before the solder joint sets. The dual-row layout with 0.118" row spacing matches standard 3.00 mm grid routing. The header is supplied in trays.