Micro-Fit 3.0 SMT Header, 16 Circuits, 3.00 mm Pitch
The Molex 430451619 is the 16-circuit, dual-row member of the Micro-Fit 3.0 43045 series — a shrouded SMT header designed for board-to-wire power interconnects in automotive, industrial, medical, and telecom equipment. Gold-plated mating contacts (15.0 µin) handle repeated mating cycles in harness service without fretting corrosion.
The 3.00 mm pitch and 0.118" row spacing set the board footprint — two rows of 8 positions each, requiring a 16-pad SMT layout with a 3.00 mm staggered grid.
Termination is SMT — the header is placed on the PCB and reflow-soldered; the solder retention features hold it in position during the process.