Molex 430451628 Micro-Fit 3.0 Header, 16-Position, 3.00 mm Pitch, 8 A
MPN430451628
Active
Molex 430451628, dual-row 16-position Micro-Fit 3.0 43045 header, 3.00 mm pitch, 8 A per circuit, gold-plated mating contacts (15.0 µin), tin solder tails (100.0 µin), 600 V, through-hole, shrouding 4-wall, locking ramp, board guide, UL94 V-0 LCP housing, -40°C to 105°C, ROHS3 Active, tray package.
$4.85Ref. price · indicative, final on quote
RoHSROHS3 Compliant
SeriesMicro-Fit 3.0 43045
Source DocumentedChannel stated on listing & quote
Condition PhotosReal unit photos / video on request
WhatsApp AnswersFast human replies for stock & sourcing questions
Worldwide DispatchDHL/FedEx — transit quoted per order
Independent China distributor & sourcing agent· Listing updated Jul 2026
Specifications
| Parameter | Value |
|---|---|
| Series | Micro-Fit 3.0 43045 |
| Type | Male Pin |
| Mounting | Through Hole |
| Connector type | Header |
| Fastening type | Locking Ramp |
| Voltage rating | 600V |
| Current rating | 8A |
| Operating temperature | -40°C ~ 105°C |
| Contact material | Brass |
| Insulation color | Black |
| Insulation height | 0.390\" (9.91mm) |
| Insulation material | Liquid Crystal Polymer (LCP), Glass Filled |
All specifications
| Parameter | Value |
|---|---|
| Material flammability rating | UL94 V-0 |
| Style | Board to Cable/Wire |
| Package | Tray |
| Features | Board Guide |
| Shrouding | Shrouded - 4 Wall |
| Termination | Solder |
| Applications | Automotive, General Purpose, Industrial, Medical, Telecommunications |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.118\" (3.00mm) |
| Positions | 16 |
| Row spacing - mating | 0.118\" (3.00mm) |
| Contact finish - post | Tin |
| Contact length - post | 0.125\" (3.18mm) |
| Contact finish - mating | Gold |
| Contact finish thickness - post | 100.0µin (2.54µm) |
| Contact finish thickness - mating | 15.0µin (0.38µm) |
Frequently asked questions
What is the difference between the gold and tin plating on this header?
Gold (15.0 µin) on the mating face gives low resistance and high durability across repeated mating cycles; tin (100.0 µin) on the solder tail provides a reliable, wettable joint for through-hole reflow — the split plating optimises for both termination integrity and mating performance without the cost of all-gold contacts.