Molex 430451628, dual-row 16-position Micro-Fit 3.0 43045 header, 3.00 mm pitch, 8 A per circuit, gold-plated mating contacts (15.0 µin), tin solder tails (100.0 µin), 600 V, through-hole, shrouding 4-wall, locking ramp, board guide, UL94 V-0 LCP housing, -40°C to 105°C, ROHS3 Active, tray package.
- New & original stockTraceable channels only — no mixed lots, no re-taped reels.
- Factory packaging where availableSealed reels, trays and bags; cut quantities always stated on the quote.
- Photo-verified countsEvery line counted and photographed before the box closes.
- PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.
Specifications
| Parameter | Value |
|---|---|
| Series | Micro-Fit 3.0 43045 |
| Gender | Male Pin |
| Mounting type | Through Hole |
| Connector type | Header |
| Fastening type | Locking Ramp |
| Voltage rating | 600V |
| Current rating | 8A |
| Operating temperature | -40°C ~ 105°C |
| Contact material | Brass |
| Insulation color | Black |
| Insulation height | 0.390\" (9.91mm) |
| Insulation material | Liquid Crystal Polymer (LCP), Glass Filled |
| Material flammability rating | UL94 V-0 |
| Style | Board to Cable/Wire |
| Package | Tray |
| Features | Board Guide |
| Shrouding | Shrouded - 4 Wall |
| Termination | Solder |
| Applications | Automotive, General Purpose, Industrial, Medical, Telecommunications |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.118\" (3.00mm) |
| Positions | 16 |
| Row spacing - mating | 0.118\" (3.00mm) |
| Contact finish - post | Tin |
| Contact length - post | 0.125\" (3.18mm) |
| Contact finish - mating | Gold |
| Contact finish thickness - post | 100.0µin (2.54µm) |
| Contact finish thickness - mating | 15.0µin (0.38µm) |
Sourcing this connector
Molex 430451628 is available through IC Source Direct’s Shenzhen interconnect channel. Submit an RFQ with your required quantity and timeline; we return a firm quote covering MOQ, lead time, condition, and unit price — typically within one business day.
Need a match by specification instead of MPN? Provide pitch, pin count, current rating, mounting style, and operating temperature. We cross-reference against Molex and other authorised lines, returning datasheet-verified alternatives. Attach a full BOM for multi-brand consolidation into one shipment.
Frequently asked questions
What is the difference between the gold and tin plating on this header?
Gold (15.0 µin) on the mating face gives low resistance and high durability across repeated mating cycles; tin (100.0 µin) on the solder tail provides a reliable, wettable joint for through-hole reflow — the split plating optimises for both termination integrity and mating performance without the cost of all-gold contacts.