The Molex 430451802 is the 18-circuit member of the Micro-Fit 3.0 43045 series, a shrouded dual-row header designed for board-to-wire power distribution. It carries 18 male pin contacts on a 3.00 mm pitch, arranged in two rows with a matching row spacing of 3.00 mm. Rated at 8 A per circuit and 600 V, it handles moderate power loads in a compact footprint.
Key features and deployment context
Contact plating is split by duty: the mating interface carries 30.0 µin (0.76 µm) of gold, rated for repeated mating cycles in corrosive or humid environments; the solder tails are tin-plated (100.0 µin / 2.54 µm) for reliable wave-solder wetting.
Position count and comparison with the 12-circuit sibling
At 18 positions, the 430451802 sits above the 12-circuit 430451210 in the same Micro-Fit 3.0 dual-row header family. Both share the 3.00 mm pitch, 8 A per circuit rating, right-angle orientation, board locks, and gold-plated mating contacts.