Micro-Fit 3.0 Header for Wire-to-Board Power
The Molex 430452014 is a 20-circuit, dual-row header from the Micro-Fit 3.0 43045 series, designed for board-to-cable/wire power interconnects. Rated at 8 A per circuit with gold-plated mating contacts and a 30.0 µin (0.76 µm) gold thickness, this header is built for repeated mating cycles in environments where contact resistance stability matters — think automotive harnesses, industrial control cabinets, or medical equipment.
No official cross-reference or direct substitute is on record; the 20-position count and 3.00 mm pitch define the mating half requirement.
This header mates with any standard Micro-Fit 3.0 receptacle housing that accepts 20 circuits in a dual-row, 3.00 mm pitch layout. The 4-wall shrouding and locking ramp are the key alignment features — the ramp engages the receptacle latch for positive retention. The through-hole posts are 0.125" (3.18 mm) long, suited for standard PCB thicknesses. Gold-on-mating, tin-on-post contact finish means the board-side solder joint is cost-optimized while the mating interface stays corrosion-resistant.