CONN HEADER R/A 20POS 3MM
$6.67Ref. price · indicative, final on quote
StockContact for availability
MOQ1 pcs
- New & original stockTraceable channels only — no mixed lots, no re-taped reels.
- Factory packaging where availableSealed reels, trays and bags; cut quantities always stated on the quote.
- Photo-verified countsEvery line counted and photographed before the box closes.
- PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.
Specifications
| Parameter | Value |
|---|---|
| Series | Micro-Fit 3.0 43045 |
| Gender | Male Pin |
| Mounting type | Through Hole, Right Angle |
| Connector type | Header |
| Fastening type | Locking Ramp |
| Voltage rating | 600V |
| Current rating | 8A |
| Operating temperature | -40°C ~ 105°C |
| Contact material | Brass |
| Insulation color | Black |
| Insulation height | 0.290\" (7.37mm) |
| Insulation material | Liquid Crystal Polymer (LCP), Glass Filled |
| Material flammability rating | UL94 V-0 |
| Style | Board to Cable/Wire |
| Package | Tray |
| Features | Board Lock |
| Shrouding | Shrouded - 4 Wall |
| Termination | Solder |
| Applications | Automotive, General Purpose, Industrial, Medical, Telecommunications |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.118\" (3.00mm) |
| Positions | 20 |
| Row spacing - mating | 0.118\" (3.00mm) |
| Contact finish - post | Tin |
| Contact length - post | 0.125\" (3.18mm) |
| Contact finish - mating | Tin |
| Contact finish thickness - mating | 60.0µin (1.52µm) |
Sourcing this connector
Molex 430452021 is available through IC Source Direct’s Shenzhen interconnect channel. Submit an RFQ with your required quantity and timeline; we return a firm quote covering MOQ, lead time, condition, and unit price — typically within one business day.
Need a match by specification instead of MPN? Provide pitch, pin count, current rating, mounting style, and operating temperature. We cross-reference against Molex and other authorised lines, returning datasheet-verified alternatives. Attach a full BOM for multi-brand consolidation into one shipment.