Molex Micro-Fit 3.0 43045 series, 430452024, dual-row 20-position header, 0.118" (3.00 mm) pitch, 8 A per circuit, 600 V, tin-plated contacts 60 µin, shrouded 4-wall with locking ramp and board lock, through-hole kinked-pin solder termination, UL94 V-0 LCP housing.
| Parameter | Value |
|---|---|
| Series | Micro-Fit 3.0 43045 |
| Type | Male Pin |
| Mounting | Through Hole |
| Connector type | Header |
| Fastening type | Locking Ramp |
| Voltage rating | 600V |
| Current rating | 8A |
| Contact material | Brass |
| Insulation color | Black |
| Insulation height | 0.390\" (9.91mm) |
| Insulation material | Liquid Crystal Polymer (LCP), Glass Filled |
| Material flammability rating | UL94 V-0 |
| Parameter | Value |
|---|---|
| Style | Board to Cable/Wire |
| Package | Tray |
| Features | Board Guide, Board Lock |
| Shrouding | Shrouded - 4 Wall |
| Termination | Kinked Pin, Solder |
| Applications | Automotive, General Purpose, Industrial, Medical, Telecommunications |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.118\" (3.00mm) |
| Positions | 20 |
| Row spacing - mating | 0.118\" (3.00mm) |
| Contact finish - post | Tin |
| Contact length - post | 0.125\" (3.18mm) |
| Contact finish - mating | Tin |
| Contact finish thickness - mating | 60.0µin (1.52µm) |
The Molex 430452024 is a 20-circuit, dual-row header from the Micro-Fit 3.0 43045 series, designed for board-to-wire power interconnects. It carries 8 A per circuit at 600 V on a 3.00 mm pitch — the 3.00 mm pitch and row spacing provide enough creepage for the 600 V rating without forcing an oversized board footprint.
The UL94 V-0 LCP housing handles the temperature rise from 8 A per circuit without issue.
The 430452024 is rated 8 A per circuit at 600 V. The 3.00 mm pitch and row spacing provide enough creepage for the 600 V rating without forcing an oversized board footprint.
Yes, the 430452024 is ROHS3 compliant.