The Molex 430452029 is a 20-position, dual-row header from the Micro-Fit 3.0 43045 series, designed for board-to-wire power and signal interconnects. It uses a 0.118" (3.00mm) pitch on both rows, with a shrouded 4-wall housing and a locking ramp for secure mating in vibration-prone environments like automotive and industrial equipment. The gold-plated mating contacts (30.0 µin) handle repeated mating cycles without fretting corrosion, while the tin-plated posts (100.0 µin) provide a reliable solder joint through the through-hole termination. The housing is molded from glass-filled LCP rated UL94 V-0, and the operating temperature range spans -40°C to 105°C, making it suitable for under-hood automotive, industrial cabinet, and telecom equipment where flame retardance and thermal cycling are requirements.
The 0.125" (3.18mm) solder tail length is standard for through-hole PCB mounting.