The Molex 430452407 is a 24-position, dual-row header from the Micro-Fit 3.0 43045 series, designed for board-to-wire power and signal interconnects. The mating interface is gold-plated at 15.0 µin, with a tin-plated solder tail at 100.0 µin — the gold side handles repeated mating cycles while the tin side ensures reliable solder wetting through reflow. The housing is a 4-wall shrouded design with a locking ramp and integrated board locks, giving it vibration resistance and positive retention during SMT assembly.
The 3.00 mm pitch and 0.118" row spacing give enough creepage for the 600 V rating without forcing an oversized board footprint — you can route a single trace between pads on a standard 1 oz copper layer.