What this header is
The Molex 430452408 is a 24-circuit dual-row Micro-Fit 3.0 header at 0.118" (3.00mm) pitch, right-angle surface-mount, with the 4-wall shroud and a locking ramp that seats into the matching receptacle housing. At 8 A per contact and 600 V it sits in the upper portion of the Micro-Fit 3.0 current range — the pitch and circuit density are mid-range, but the current headroom makes it a legitimate power-interconnect candidate across the listed applications. The mating side carries 30.0 µin (0.76 µm) gold over nickel; the solder post side is 100.0 µin (2.54 µm) tin — the gold thickness on the mating interface is the relevant number for reconnect-cycle life, while the heavy tin on the post governs solder joint wettability and shelf-life robustness.
What the ratings mean for your fit
Pitch is 3.00 mm — the board footprint and routing density follow directly from this. The dual-row layout with 0.118" row spacing is the standard Micro-Fit 3.0 board pattern; verify your trace pitch and keep-out matches before committing. Insulation height is 0.290" (7.37 mm) — this determines the standoff above the PCB surface and feeds into the mated pair's overall z-height envelope when paired with the receptacle housing. Operating temperature range is -40°C to 105°C — covers automotive under-hood and industrial enclosure environments comfortably within the LCP housing's UL94 V-0 rating.
What it mates with
All 24 positions are loaded — the header ships fully populated, not as a cut tape of individual pins.
Sourcing and compliance
Active lifecycle, ROHS3 compliant — clears the environmental compliance check for new designs and existing BOMs alike. Quoted to order against BOM quantity; confirm the tape-and-reel or cut-tape packaging preference at RFQ.