Board-Layout Fit: Right-Angle SMT with 30 µ" Gold
The 43650-0514: The 30 µinch gold plating on the mating interface supports repeated connect/disconnect cycles in field-service or test-point applications — the contact wear margin is well above the tin-plate threshold for occasional mate events. The SMT tails reflow with the rest of the board-side components in a single pass.
Available through independent distribution channels.